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BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8236T6N
SiGe:C LOW NOISE AMPLIFIER FOR GPS
DESCRIPTION
The PC8236T6N is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise amplifier for GPS. This device exhibits low noise figure and high power gain characteristics, so this IC can improve the sensitivity of GPS receiver. In addition, the PC8236T6N which is included output matching circuit contributes to reduce external components and system size. The package is a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) suitable for surface mount. This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process.
FEATURES
* Supply voltage * Low noise * High gain * Low current consumption * Built-in power-saving function * High-density surface mounting * Included output matching circuit * Included very robust bandgap regulator (Small VCC and TA dependence) * Included protection circuits for ESD : VCC = 1.6 to 3.3 V (2.7 V TYP.) : NF = 0.8 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz : NF = 0.8 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz : GP = 19.5 dB TYP. @ VCC = 2.7 V, fin = 1 575 MHz : GP = 19.1 dB TYP. @ VCC = 1.8 V, fin = 1 575 MHz : ICC = 6.5 mA TYP. @ VCC = 2.7 V : VPSon = 1.0 V to VCC, VPSoff = 0 to 0.4 V : 6-pin plastic TSON (T6N) package (1.5 x 1.5 x 0.37 mm)
APPLICATION
* Low noise amplifier for GPS
ORDERING INFORMATION
Part Number Order Number Package 6-pin plastic TSON (T6N) (Pb-Free) Marking 6S Supplying Form * 8 mm wide embossed taping * Pin 1, 6 face the perforation side of the tape * Qty 3 kpcs/reel
PC8236T6N-E2
PC8236T6N-E2-A
Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC8236T6N-A
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PU10713EJ01V0DS (1st edition) Date Published March 2008 NS
2008
PC8236T6N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View) (Top View) (Bottom View)
Pin No. 1 Pin Name VCC GND INPUT Power Save OUTPUT VCC
1
6
1
6
6
1
2 3
6S
Parameter Parameter Parameter
2
5
2
5
5
2
4 5 6
Bias
3
4
3
4
4
3
Remark Exposed pad : GND
ABSOLUTE MAXIMUM RATINGS
Symbol VCC VPS Ptot TA Tstg Pin TA = +25C TA = +25C Test Conditions Ratings 4.0 4.0 150 -40 to +85 -55 to +150 +10 Unit V V mW C C dBm
Supply Voltage Power-Saving Voltage Total Power Dissipation Operating Ambient Temperature Storage Temperature Input Power
RECOMMENDED OPERATING RANGE
Symbol VCC TA VPSon VPSoff MIN. 1.6 -40 1.0 0 TYP. 2.7 +25 - - MAX. 3.3 +85 VCC 0.4 Unit V C V V
Supply Voltage Operating Ambient Temperature Power Save Turn-on Voltage Power Save Turn-off Voltage
ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified)
Symbol ICC Test Conditions No Signal (VPS = 2.7 V) At Power-Saving Mode (VPS = 0 V) Power Gain Noise Figure Input Return Loss Output Return Loss GP NF RLin RLout Pin = -35 dBm MIN. 5.0 - 17 - 7.5 11 TYP. 6.5 - 19.5 0.8 11 14 MAX. 8.0 1 22 1.1 - - Unit mA
Circuit Current
A
dB dB dB dB
2
Data Sheet PU10713EJ01V0DS
PC8236T6N
STANDARD CHARACTERISTICS FOR REFERENCE 1 (TA = +25C, VCC = VPS = 2.7 V, fin = 1 575 MHz, unless otherwise specified)
Parameter Input 3rd Order Intercept Point Isolation Gain 1 dB Compression Input Power Symbol IIP3 ISL Pin (1 dB) Test Conditions fin1 = 1 575 MHz, fin2 = 1 574 MHz Reference -3 39 -18 Unit dBm dB dBm
STANDARD CHARACTERISTICS FOR REFERENCE 2 (TA = +25C, VCC = VPS = 1.8 V, fin = 1 575 MHz, unless otherwise specified)
Parameter Circuit Current Power Gain Noise Figure Input 3rd Order Intercept Point Input Return Loss Output Return Loss Isolation Gain 1 dB Compression Input Power Symbol ICC GP NF IIP3 RLin RLout ISL Pin (1 dB) fin1 = 1 575 MHz, fin2 = 1 574 MHz Test Conditions No Signal (VPS = 1.8 V) Pin = -35 dBm Reference 6.2 19.1 0.8 -5 11 14 39 -19 Unit mA dB dB dBm dB dB dB dBm
TEST CIRCUIT
VCC 1 000 pF
1
6 1 000 pF
2
5 1.0 pF
OUTPUT
INPUT 1 000 pF 4.7 nH
3
4
VPS
Data Sheet PU10713EJ01V0DS
3
PC8236T6N
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE
10 9 TA = +85C
Circuit Current ICC (mA)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
10 9
Circuit Current ICC (mA)
VCC = 2.7 V
8 7 6 5 4 3 2 1 0 1
8 7 6 5 4 3 2 1 VCC = VPS RF = off -25 0 25 50 75 100 1.8 V
+25C -40C
VCC = VPS RF = off 2 3 4
0 -50
Supply Voltage VCC (V)
Operating Ambient Temperature TA (C)
CIRCUIT CURRENT vs. POWER-SAVING VOLTAGE
10 9
Circuit Current ICC (mA) Circuit Current ICC (mA)
CIRCUIT CURRENT vs. POWER-SAVING VOLTAGE
10 9
8 7 6 +25C 5 4 3 2 1 0 0
TA = +85C
8 7 6 5 4 3 2 1 +25C
TA = +85C
-40C
-40C
VCC = 2.7 V RF = off 1 2 3
VCC = 1.8 V RF = off 1 2 3
0 0
Power-Saving Voltage VPS (V)
Power-Saving Voltage VPS (V)
POWER GAIN vs. FREQUENCY
26 24 22 20 18 16 14 VCC = VPS = 2.7 V 12 1 500 1 525 1 550 1 575 1 600 1 625 1 650 +85C +25C
Noise Figure NF (dB)
NOISE FIGURE vs. FREQUENCY
1.8 1.6
TA = -40C
Power Gain GP (dB)
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1 500
TA = +85C
+25C
-40C 1 525 1 550 1 575
VCC = VPS = 2.7 V 1 600 1 625 1 650
Frequency fin (MHz)
Frequency fin (MHz)
Remark The graphs indicate nominal characteristics.
4
Data Sheet PU10713EJ01V0DS
PC8236T6N
POWER GAIN vs. FREQUENCY
26 24 22 20 18 16 14 VCC = VPS = 1.8 V 12 1 500 1 525 1 550 1 575 1 600 1 625 1 650 +85C +25C
Noise Figure NF (dB) Power Gain GP (dB)
NOISE FIGURE vs. FREQUENCY
1.8 1.6
TA = -40C
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1 500
TA = +85C
+25C
-40C 1 525 1 550 1 575
VCC = VPS = 1.8 V 1 600 1 625 1 650
Frequency fin (MHz)
Frequency fin (MHz)
POWER GAIN vs. SUPPLY VOLTAGE
26 24
Power Gain GP (dB)
NOISE FIGURE vs. SUPPLY VOLTAGE
1.8 1.6
Noise Figure NF (dB)
TA = -40C
VCC = VPS fin = 1 575 MHz TA = +85C
1.4 1.2 1.0 0.8 0.6 0.4 0.2
22 20 18 +25C 16 +85C 14 12 1.0 1.5 2.0 2.5 VCC = VPS fin = 1 575 MHz 3.0 3.5 4.0
+25C
-40C 0.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Supply Voltage VCC (V)
Supply Voltage VCC (V)
POWER GAIN vs. OPERATING AMBIENT TEMPERATURE
26 24 22 20 18 16 14 12 -50 25 1.8 V VCC = 2.7 V
Noise Figure NF (dB) Power Gain GP (dB)
NOISE FIGURE vs. OPERATING AMBIENT TEMPERATURE
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 1.8 V VCC = 2.7 V VCC = VPS fin = 1 575 MHz
-25
0
VCC = VPS fin = 1 575 MHz 75 100 50
0
25
50
75
100
Operating Ambient Temperature TA (C)
Operating Ambient Temperature TA (C)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10713EJ01V0DS
5
PC8236T6N
OUTPUT POWER vs. INPUT POWER
10 VCC = VPS = 2.7 V fin = 1 575 MHz 0 10 VCC = VPS = 1.8 V fin = 1 575 MHz 0
OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
Output Power Pout (dBm)
-10
-10
-20 Pin (1dB) = -17.9 dBm -30 -50 -40 -30 -20 -10
-20 Pin (1dB) = -18.5 dBm -30 -50 -40 -30 -20 -10
Input Power Pin (dBm)
Input Power Pin (dBm)
POWER GAIN vs. INPUT POWER
25 VCC = VPS = 2.7 V fin = 1 575 MHz 20
Power Gain GP (dB) Power Gain GP (dB)
POWER GAIN vs. INPUT POWER
25 VCC = VPS = 1.8 V fin = 1 575 MHz 20
15
15
10
10
5 Pin (1dB) = -17.9 dBm 0 -50 -40 -30 -20 -10 0
5 Pin (1dB) = -18.5 dBm 0 -50 -40 -30 -20 -10 0
Input Power Pin (dBm)
Input Power Pin (dBm)
Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm)
Output Power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm)
OUTPUT POWER, IM3 vs. INPUT POWER
+20 VCC = VPS = 2.7 V fin1 = 1 575 MHz 0 fin2 = 1 574 MHz Pout
OUTPUT POWER, IM3 vs. INPUT POWER
+20 VCC = VPS = 1.8 V fin1 = 1 575 MHz 0 fin2 = 1 574 MHz Pout
-20 -40 -60 -80 IIP3 = -3.5 dBm -100 -40 -30 -20 -10 0
-20 -40 -60 -80 IIP3 = -4.7 dBm -100 -40 -30 -20 -10 0
IM3
IM3
Input Power Pin (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PU10713EJ01V0DS
PC8236T6N
GAIN 1 dB COMPRESSION INPUT POWER vs. SUPPLY VOLTAGE
-5
Gain 1 dB Compression Input Power Pin (1 dB) (dBm)
IIP3, OIP3 vs. SUPPLY VOLTAGE
Input 3rd Order Intercept Point IIP3 (dBm) Output 3rd Order Intercept Point OIP3 (dBm)
20 TA = +85C 15 10 5 TA = -40C 0 IIP3 -5 -10 -15 1.0 +85C 1.5 2.0 2.5 +25C VCC = VPS fin1 = 1 575 MHz fin2 = 1 574 MHz 3.0 3.5 4.0 OIP3 -40C +25C
-10
TA = +85C -15
-20 +25C -40C -25 1.0 1.5 2.0 2.5 VCC = VPS fin = 1 575 MHz 3.0 3.5 4.0
Supply Voltage VCC (V)
Supply Voltage VCC (V)
Gain 1 dB Compression Input Power Pin (1 dB) (dBm)
GAIN 1 dB COMPRESSION INPUT POWER vs. OPERATING AMBIENT TEMPERATURE
Input 3rd Order Intercept Point IIP3 (dBm) Output 3rd Order Intercept Point OIP3 (dBm)
IIP3, OIP3 vs. OPERATING AMBIENT TEMPERATURE
20 VCC = 2.7 V 15 OIP3 10 1.8 V 5 VCC = 2.7 V 0 IIP3 -5 -10 -15 -50 1.8 V VCC = VPS fin1 = 1 575 MHz fin2 = 1 574 MHz 100 50 75
-5
-10
-15
VCC = 2.7 V
-20 1.8 V -25 -50 -25 0 25 VCC = VPS fin = 1 575 MHz 50 75 100
-25
0
25
Operating Ambient Temperature TA (C)
Operating Ambient Temperature TA (C)
K FACTOR vs. FREQUENCY
20 VCC = VPS = 2.7 V 15
K factor K K factor K
K FACTOR vs. FREQUENCY
20 VCC = VPS = 1.8 V 15
10
10
5
5
0
1
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency fin (GHz)
1
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency fin (GHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10713EJ01V0DS
7
PC8236T6N
S-PARAMETERS (TA = +25C, VCC = VPS = 2.7 V, monitored at connector on board)
S11-FREQUENCY
1:1 575 MHz 31.80 14.00 1 1
S22-FREQUENCY
1:1 575 MHz 62.80 -11.60
START 100.000 000 MHz
STOP 5 000.000 000 MHz
START 100.000 000 MHz
STOP 5 000.000 000 MHz
INPUT RETURN LOSS vs. FREQUENCY
0 Output Return Loss RLout (dB) 500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 Frequency fin (MHz) Input Return Loss RLin (dB)
OUTPUT RETURN LOSS vs. FREQUENCY
0 -5 -10 -15 -20 -25 -30 0
-5
-10
-15
-20 0
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 Frequency fin (MHz)
POWER GAIN vs. FREQUENCY
30 25 Power Gain GP (dB) 20 15 10 5 0 0 Isolation ISL (dB) 0 -10 -20 -30 -40 -50 -60 500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 Frequency fin (MHz) -70 0
ISOLATION vs. FREQUENCY
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 Frequency fin (MHz)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PU10713EJ01V0DS
PC8236T6N
S-PARAMETERS (TA = +25C, VCC = VPS = 1.8 V, monitored at connector on board)
S11-FREQUENCY
1:1 575 MHz 33.15 13.30 1 1
S22-FREQUENCY
1:1 575 MHz 61.05 -14.10
START 100.000 000 MHz
STOP 5 000.000 000 MHz
START 100.000 000 MHz
STOP 5 000.000 000 MHz
INPUT RETURN LOSS vs. FREQUENCY
0 Output Return Loss RLout (dB) 500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 Frequency fin (MHz) Input Return Loss RLin (dB)
OUTPUT RETURN LOSS vs. FREQUENCY
0 -5 -10 -15 -20 -25 -30 0
-5
-10
-15
-20 0
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 Frequency fin (MHz)
POWER GAIN vs. FREQUENCY
30 25 Power Gain GP (dB) 20 15 10 5 0 0 Isolation ISL (dB) 0 -10 -20 -30 -40 -50 -60 500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 Frequency fin (MHz) -70 0
ISOLATION vs. FREQUENCY
500 1 000 1 500 2 000 2 500 3 000 3 500 4 000 4 500 5 000 Frequency fin (MHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10713EJ01V0DS
9
PC8236T6N
PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (T6N) (UNIT: mm)
(Top View)
1.50.1
(Side View)
(Bottom View)
0.30.07 (0.24)
0.50.06
1.50.1
0.08 MIN.
0.37+0.03 -0.05
0.2+0.07 -0.05
0.20.1
A
A
0.70.1
Remark A>0 ( ) : Reference value
10
Data Sheet PU10713EJ01V0DS
1.20.1
PC8236T6N
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) Do not supply DC voltage to INPUT pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260
For soldering
Preheating temperature (package surface temperature) : 120C or below
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10713EJ01V0DS
11
PC8236T6N
* The information in this document is current as of March, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1

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